U-Bump Metalization - Tango
4.8 (532) In stock
As the foundation of wafer bumping processing, the Under-Bump Metallization (UBM) stack must provide a strong, stable low resistance electrical connection to the IC’s pads and the surrounding
UBM (OPM: Over Pad Metal, FSM: Front Side Metal and Electroless
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Advanced under-bump metallization (UBM) with the AP&S e-less
UBM (OPM: Over Pad Metal, FSM: Front Side Metal and Electroless
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